Semiconductor Package Structure and Die-bonding Film Technology
نویسندگان
چکیده
منابع مشابه
Semiconductor Die Bonding
Adhesive die attach materials are suspensions of metal particles in a carrier. The particles are several μm in size, usually in the form of thin flakes of silver. The carrier provides adhesion and cohesion to make a bond with the correct mechanical strength, while the metal particles provide electrical and thermal conductivity. It is noticeable that conductive resins are now often used where no...
متن کاملStructure and bonding of small semiconductor clusters.
We calculate the geometrical and electronic structure of small Sin, Sin +, and Sin clusters up to sites n = 14 within a combined tight-binding-density-functional-theory scheme. Especially stable structures for n = 6 and 10 coincide with observed abundancies in the experimental mass spectra. All equilibrium structures are found to be close packed, with a different bonding than found in the bulk ...
متن کاملEffect of Die Bonding Condition for Die Attach Film Performance in 3D QFN Stacked Die
Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...
متن کامل2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the ...
متن کاملBonding Semiconductor Laser Chips: Substrate Material Figure of Merit and Die Attach Layer Influence
The coefficient of thermal expansion (CTE) and the thermal conductivity are the two key parameters to consider when selecting a particular substrate material for a die bonding process. We will discuss here a model to determine the substrate material giving the best chip reliability expectations for GaAs and InP laser chips. In that respect, a comparison of the thermo-mechanical stresses induced...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Seikei-Kakou
سال: 2014
ISSN: 0915-4027,1883-7417
DOI: 10.4325/seikeikakou.26.556